Flux Paste Solder Paste Tin No-Clean for Phone Repair Soldering 559 NC-559-28um($15.25Value)

Description

USED IN---Used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system REDUCE THE TENSION OF THE MATERIAL---The tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material. SMALL SIZE---Small size, easy to carry and store, convenient to use and with good performance HIGH TIN RUNNING SPEED---High tin running speed, low smoke emission, and high insulation on the after curing PREVENT THE OXIDATION---The high temperature of soldering is easy to oxidize the of the soldering material, and the solder paste helps prevent the oxidation process Feature:
1. Used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system
2. High tin running speed, low smoke emission, and high insulation on the after curing
3. The high temperature of soldering is easy to oxidize the of the soldering material, and the solder paste helps prevent the oxidation process
4. The tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material.
5. Small size, easy to carry and store, convenient to use and with good performance

Specification:
Item Type: Flux
Flux Type: NC-559-
Paste Weight: Approx. 100 g / 3.5 oz
Granularity: 28 (um)
Viscosity: 180 (Pa¡¤S)
Soldering Paste: Widely used in clocks and watches, accurate parts, stainless steel crafts, tableware, mobile communications, digital products, air conditioning and refrigerator refrigeration equipment, glasses, knives, car radiators and various PCB boards and BGA solder balls Brazing

Package List:
1 x Flux